Vibrator element, vibrator device, and method of manufacturing vibrator element

ABSTRACT

The vibrator element includes a vibrating arm provided with an arm part, and a weight part which has a weight, the weight is provided with at least one processing scar, when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is a centroid axis, the processing scar is formed in at least an area at an opposite side to the centroid axis, and S1&lt;S2 an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2.

The present application is based on, and claims priority from JPApplication Serial Number 2020-027013, filed Feb. 20, 2020, thedisclosure of which is hereby incorporated by reference herein in itsentirety.

BACKGROUND 1. Technical Field

The present disclosure relates to a vibrator element, a vibrator device,and a method of manufacturing a vibrator element.

2. Related Art

For example, in JP-A-2009-171553 (Document 1), there is described amethod of providing a tip part of a vibrating arm with a metal film, andthen irradiating the metal film with a laser beam to thereby remove apart of the metal film as a method of adjusting the frequency of atuning-fork vibrator element.

The tuning-fork vibrator element described in Document 1 is providedwith grooves disposed on an upper surface and a lower surface of thevibrating arm, and electrodes formed in the grooves in order to furtherenhance the piezoelectric effect. However, since the grooves are formedusing wet etching, the shape of the groove becomes asymmetric about thecentral axis of the vibrating arm due to the etching anisotropy causedby the crystal axes of quartz crystal. When the shape of the groovebecomes asymmetric about the central axis of the vibrating arm, thecentroid of the vibrating arm is shifted from the central axis, and anunwanted vibration (spurious vibration) is excited due to the shift.

In such a tuning-fork vibrator element, when, for example, a weight isirradiated with the laser beam so as to be symmetric about the centralaxis, there arises a problem that the shift of the centroid from thecentral axis increases, and thus, the unwanted vibration increases.

SUMMARY

A vibrator element according to an application example includes a basepart, and a vibrating arm provided with an arm part which is coupled tothe base part, which has a groove opening in a principal surface, andwhich has an elongated shape, and a weight part which is located at atip side of the arm part, and which has a weight disposed on theprincipal surface, wherein the weight is provided with at least oneprocessing scar which is partially removed, and which is recessed in athickness direction of the vibrating arm, when an axis which overlaps acenter in a width direction of the vibrating arm, and which extendsalong an extending direction of the vibrating arm is defined as acentral axis, and an axis which overlaps a centroid of the vibratingarm, and which extends along the extending direction of the vibratingarm is defined as a centroid axis in a plan view of the principalsurface, the processing scar is formed in at least an area at anopposite side to the centroid axis with respect to the central axis, andS1<S2, an area of the processing scar located at the centroid axis sidewith respect to the central axis is S1, and an area of the processingscar located at an opposite side to the centroid axis with respect tothe central axis is S2.

A vibrator device according to an application example includes thevibrator element described above.

A method of manufacturing a vibrator element according to an applicationexample includes the steps of preparing a vibrator element having abasepart, and a vibrating arm provided with an arm part which is coupled tothe base part, which has a groove opening in a principal surface, andwhich has an elongated shape, and a weight part which is located at atip side of the arm part, and which has a weight disposed on theprincipal surface, and forming at least one processing scar to theweight by irradiating the weight with a laser beam to thin or remove theweight in a thickness direction of the vibrating arm, wherein when anaxis which overlaps a center in a width direction of the vibrating arm,and which extends along an extending direction of the vibrating arm isdefined as a central axis, and an axis which overlaps a centroid of thevibrating arm, and which extends along the extending direction of thevibrating arm is defined as a centroid axis in a plan view of theprincipal surface, the processing scar is formed in at least an area atan opposite side to the centroid axis with respect to the central axisin the step of forming at least one processing scar, and S1<S2, an areaof the processing scar located at the centroid axis side with respect tothe central axis is S1, and an area of the processing scar located at anopposite side to the centroid axis with respect to the central axis isS2.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a vibrator device according toa first embodiment of the present disclosure.

FIG. 2 is a plan view of the vibrator device shown in FIG. 1.

FIG. 3 is a plan view of a vibrator element provided to the vibratordevice shown in FIG. 1.

FIG. 4 is a cross-sectional view along the line A-A in FIG. 3.

FIG. 5 is a cross-sectional view along the line B-B in FIG. 3.

FIG. 6 is a schematic diagram for explaining an action of the vibratorelement shown in FIG. 3.

FIG. 7 is a schematic diagram for explaining an action of the vibratorelement shown in FIG. 3.

FIG. 8 is a cross-sectional view of a drive arm provided to the vibratorelement shown in FIG. 3.

FIG. 9 is a cross-sectional view of a detection arm provided to thevibrator element shown in FIG. 3.

FIG. 10 is a cross-sectional view showing a shape of a groove in thedrive arm.

FIG. 11 is a cross-sectional view showing an unwanted vibration of thedrive arm.

FIG. 12 is a cross-sectional view showing an unwanted vibration of thedetection arm.

FIG. 13 is a cross-sectional view showing a modified example of a groovein the drive arm.

FIG. 14 is a plan view showing processing scars provided to a weight.

FIG. 15 is a diagram showing a manufacturing process of the vibratordevice shown in FIG. 1.

DESCRIPTION OF AN EXEMPLARY EMBODIMENT

A vibrator element, a vibrator device, and a method of manufacturing avibrator element according to the present disclosure will hereinafter bedescribed in detail based on an embodiment shown in the accompanyingdrawings.

First Embodiment

FIG. 1 is a cross-sectional view showing a vibrator device according toa first embodiment of the present disclosure. FIG. 2 is a plan view ofthe vibrator device shown in FIG. 1. FIG. 3 is a plan view of a vibratorelement provided to the vibrator device shown in FIG. 1. FIG. 4 is across-sectional view along the line A-A in FIG. 3. FIG. 5 is across-sectional view along the line B-B in FIG. 3. FIG. 6 and FIG. 7 areeach a schematic diagram for explaining an action of the vibratorelement shown in FIG. 3. FIG. 8 is a cross-sectional view of a drive armprovided to the vibrator element shown in FIG. 3. FIG. 9 is across-sectional view of a detection arm provided to the vibrator elementshown in FIG. 3. FIG. 10 is a cross-sectional view showing a shape of agroove in the drive arm. FIG. 11 is a cross-sectional view showing anunwanted vibration of the drive arm. FIG. 12 is a cross-sectional viewshowing an unwanted vibration of the detection arm. FIG. 13 is across-sectional view showing a modified example of a groove in the drivearm. FIG. 14 is a plan view showing processing scars provided to aweight. FIG. 15 is a diagram showing a manufacturing process of thevibrator device shown in FIG. 1.

It should be noted that in each of the drawings except FIG. 15 throughFIG. 17, there are shown an X axis, a Y axis, and a Z axis as three axesperpendicular to each other for the sake of convenience of explanation.Further, a direction parallel to the X axis is also referred to as anX-axis direction, a direction parallel to the Y axis is also referred toas a Y-axis direction, and a direction parallel to the Z axis is alsoreferred to as a Z-axis direction. Further, the arrow side of each ofthe axes is also referred to as a positive side, and the opposite sideis also referred to as a negative side. Further, the positive side inthe Z-axis direction is also referred to as an “upper side,” and thenegative side thereof is also referred to as a “lower side.” Further, aplan view viewed from the Z-axis direction is also referred to simply asa “plan view.” Further, as described later, the X axis, the Y axis, andthe Z axis also correspond to the crystal axes of quartz crystal.

The vibrator device 1 shown in FIG. 1 is a physical quantity sensor fordetecting angular velocity ωz defining the Z axis as the detection axis.As described above, by using the vibrator device 1 as the physicalquantity sensor, it is possible to install the vibrator device 1 in awide variety of electronic apparatuses, and thus, the vibrator device 1which has a high demand, and is high in convenience is achieved. Such avibrator device 1 has a package 2, a circuit element 3 housed in thepackage 2, a support substrate 4, and a vibrator element 6.

The package 2 has a base 21 provided with a recessed part 211 opening inan upper surface, and a lid 22 which closes the opening of the recessedpart 211 and is bonded to the upper surface of the base 21 via a bondingmember 23. The recessed part 211 forms an internal space S inside thepackage 2, and the circuit element 3, the support substrate 4, and thevibrator element 6 are each housed in the internal space S. For example,the base 21 can be formed of ceramics such as alumina, and the lid 22can be formed of a metal material such as kovar. It should be noted thatthe constituent materials of the base 21 and the lid 22 are notparticularly limited.

The internal space S is airtightly sealed, and is set in areduced-pressure state, and more preferably a state approximate to avacuum state. Thus, the viscosity resistance reduces and the vibrationcharacteristics of the vibrator element 6 are improved. It should benoted that the atmosphere in the internal space S is not particularlylimited, but can also be, for example, in the atmospheric pressure stateor a pressurized state.

Further, the recessed part 211 is constituted by a plurality of recessedparts, and has a recessed part 211 a, a recessed part 211 b, and arecessed part 211 c wherein the recessed part 211 a opens in the uppersurface of the base 21, the recessed part 211 b opens in a bottomsurface of the recessed part 211 a and is smaller in opening width thanthe recessed part 211 a, and the recessed part 211 c opens in a bottomsurface of the recessed part 211 b and is smaller in opening width thanthe recessed part 211 b. Further, to the bottom surface of the recessedpart 211 a, there is fixed the support substrate 4 in a state ofsupporting the vibrator element 6, and to a bottom surface of therecessed part 211 c, there is fixed the circuit element 3.

Further, in the internal space S, the vibrator element 6, the supportsubstrate 4, and the circuit element 3 are disposed so as to overlapeach other in a plan view. In other words, the vibrator element 6, thesupport substrate 4, and the circuit element 3 are arranged side by sidealong the Z axis. Thus, it is possible to suppress the planar spreadtowards the X-axis direction and the Y-axis direction of the package 2,and thus, it is possible to achieve reduction in size of the vibratordevice 1. Further, the support substrate 4 is located between thevibrator element 6 and the circuit element 3, and supports the vibratorelement 6 so as to hold the vibrator element 6 from the lower side.

Further, as shown in FIG. 1 and FIG. 2, on the bottom surface of therecessed part 211 a, there is disposed a plurality of internal terminals241, on the bottom surface of the recessed part 211 b, there is disposeda plurality of internal terminals 242, and on the lower surface of thebase 21, there is disposed a plurality of external terminals 243. Theinternal terminals 241, 242 and the external terminals 243 describedabove are electrically coupled via interconnections not shown formedinside the base 21. Further, the internal terminals 241 are electricallycoupled to the vibrator element 6 via the support substrate 4, and theinternal terminals 242 are electrically coupled to the circuit element 3via bonding wires BW.

The vibrator element 6 is an angular velocity sensor element capable ofdetecting the angular velocity defining the Z axis as the detectionaxis, that is, the angular velocity ωz around the Z axis. As shown inFIG. 3, the vibrator element 6 has a vibrating substrate 7, andelectrodes 8 disposed on a surface of the vibrating substrate 7, andweights 9.

The vibrating substrate 7 is formed of a Z-cut quartz crystal substrate.The Z-cut quartz crystal substrate has spread in an X-Y plane defined bythe X axis as the electrical axis and the Y axis as the mechanical axis,and has a thickness in a direction along the Z axis as the optical axis,the electrical axis, the mechanical axis, and the optical axis being thecrystal axes of quartz crystal. Further, the vibrating substrate 7 has abase part 70, a pair of detection arms 71, 72, a pair of coupling arms73, 74, a pair of drive arms 75, 76, and a pair of drive arms 77, 78,wherein the base part 70 is located in a central portion, the pair ofdetection arms 71, 72 extend toward both sides in the Y-axis directionfrom the base part 70, the pair of coupling arms 73, 74 extend towardboth sides in the X-axis direction from the base part 70, the pair ofdrive arms 75, 76 extend toward the both sides in the Y-axis directionfrom a tip part of the coupling arm 73, and the pair of drive arms 77,78 extend toward the both sides in the Y-axis direction from a tip partof the coupling arm 74. In the present embodiment, the detection arms71, 72, and the drive arms 75, 76, 77, and 78 are each a vibrating arm.

Further, the driving arms 75, 76, 77, and 78 have arm parts 750, 760,770, and 780 extending in the Y-axis direction from the coupling arms73, 74, and wide portions 751, 761, 771, and 781 as weight parts locatedcloser to the tips of the armparts 750, 760, 770, and 780, respectively.Further, the arm parts 750, 760, 770, and 780 each have an elongatedshape extending in the Y-axis direction, and each have the width in theX-axis direction substantially constant along the extending direction.In contrast, the wide portions 751, 761, 771, and 781 are larger inwidth in the X-axis direction than the armparts 750, 760, 770, and 780respectively located closer to the base end thereof. Further, thecontour shape of each of the drive arms 75, 76, 77, and 78 is symmetricabout the Y axis in a plan view from the Z-axis direction. It should benoted that term “symmetric” described above means that there is includedwhen the right and left shapes include an error which can occur inmanufacturing such as a shape shift when performing wet etching due tothe crystal axes of quartz crystal besides when the right and leftshapes coincide with each other. This substantially applies also to thedetection arms 71, 72 described below.

Further, the detection arms 71, 72 have arm parts 710, 720 extending inthe X-axis direction from the base part 70 and wide portions 711, 721 asthe weight parts respectively located closer to the tips of the armparts 710, 720, respectively. Further, the arm parts 710, 720 each havean elongated shape extending in the Y-axis direction, and each have thewidth in the X-axis direction substantially constant along the extendingdirection. In contrast, the wide portions 711, 721 are larger in widthin the X-axis direction than the arm parts 710, 720 respectively locatedcloser to the base end thereof. Further, the contour shape of each ofthe detection arms 71, 72 is symmetric about the Y axis in a plan viewfrom the Z-axis direction.

By providing the wide portions 711, 721, 751, 761, 771, and 781 to therespective arms in such a manner, when performing comparison at the samefrequency, it is possible to shorten the detection arms 71, 72 and thedrive arms 75, 76, 77, and 78, and thus, reduction in size of thevibrator element 6 can be achieved. Further, since the length of each ofthe detection arms 71, 72 and the drive arms 75, 76, 77, and 78 isshortened, the viscosity resistance when these arms vibrate decreases,and thus, the vibration characteristics of the vibrator element 6 areimproved. Such wide portions 711, 721, 751, 761, 771, and 781 are eachcalled a “hammerhead.”

Further, as shown in FIG. 4 and FIG. 5, the arm parts 750, 760, 770, and780 of the drive arms 75, 76, 77, and 78 are provided with grooves 752,762, 772, and 782 each opening in an upper surface as one principalsurface, and grooves 753, 763, 773, and 783 each opening in a lowersurface as the other principal surface, respectively. The grooves 752,762, 772, 782, 753, 763, 773, and 783 each extend along the Y-axisdirection as the extending direction of the arm parts 750, 760, 770, and780, and are each formed throughout a substantially entire area in theextending direction of corresponding one of the arm parts 750, 760, 770,and 780. Therefore, the arm parts 750, 760, 770, and 780 each form asubstantially H-like cross-sectional shape in a substantially entirearea in the extending direction.

Similarly, the arm parts 710, 720 of the detection arms 71, 72 arerespectively provided with grooves 712, 722 each opening in an uppersurface as one principal surface, and grooves 713, 723 each opening in alower surface as the other principal surface. The grooves 712, 722, 713,and 723 each extend along the Y-axis direction as the extendingdirection of the arm parts 710, 720, and are each formed throughout asubstantially entire area in the extending direction of correspondingone of the arm parts 710, 720. Therefore, the arm parts 710, and 720each form a substantially H-like cross-sectional shape in asubstantially entire area in the extending direction.

By providing the grooves to the respective arm parts in such a manner,it is possible to reduce the thermoelastic loss, and thus, the vibrationcharacteristics of the vibrator element 6 are improved.

The electrodes 8 have drive signal electrodes 81, driveconstant-potential electrodes 82, first detection signal electrodes 83,first detection ground electrodes 84 as detection constant-potentialelectrodes, second detection signal electrodes 85, and second detectionground electrodes 86 as the detection constant-potential electrodes.

The drive signal electrodes 81 are disposed on the both side surfaces ofeach of the drive arms 75, 76, and the upper surface and the lowersurface of each of the drive arms 77, 78. Meanwhile, the driveconstant-potential electrodes 82 are disposed on the upper surface andthe lower surface of each of the drive arms 75, 76, and the both sidesurfaces of each of the drive arms 77, 78. Further, the first detectionsignal electrodes 83 are disposed on the upper surface and the lowersurface of the detection arm 71, and the first detection groundelectrodes 84 are disposed on the both side surfaces of the detectionarm 71. Meanwhile, the second detection signal electrodes 85 aredisposed on the upper surface and the lower surface of the detection arm72, and the second detection ground electrodes 86 are disposed on theboth side surfaces of the detection arm 72.

These electrodes 81 through 86 are each laid around to a lower surfaceof the base part 70. Therefore, on the lower surface of the base part70, there are disposed a terminal 701 electrically coupled to the drivesignal electrode 81, a terminal 702 electrically coupled to the driveconstant-potential electrode 82, a terminal 703 electrically coupled tothe first detection signal electrode 83, a terminal 704 electricallycoupled to the first detection ground electrode 84, a terminal 705electrically coupled to the second detection signal electrode 85, and aterminal 706 electrically coupled to the second detection groundelectrode 86.

Such a vibrator element 6 detects the angular velocity ωz in thefollowing manner. First, when applying a drive signal between the drivesignal electrode 81 and the drive constant-potential electrode 82, thedrive arms 75 through 78 flexurally vibrate along an X-Y plane as shownin FIG. 6. Hereinafter, this drive mode is referred to as a drivevibration mode. Further, when the angular velocity ωz is applied to thevibrator element 6 in the state of performing the drive in the drivevibration mode, a detection vibration mode shown in FIG. 7 is newlyexcited. In the detection vibration mode, a Coriolis force acts on thedrive arms 75 through 78 to excite the vibration in a directionrepresented by the arrows b, and in concert with this vibration, thedetection vibration due to the flexural vibration occurs in a directionrepresented by the arrows a in the detection arms 71, 72.

Then, a charge generated in the detection arm 71 due to the detectionvibration mode is taken out between the first detection signal electrode83 and the first detection ground electrode 84 as a first detectionsignal, a charge generated in the detection arm 72 is taken out betweenthe second detection signal electrode 85 and the second detection groundelectrode 86 as a second detection signal, and it is possible to detectthe angular velocity ωz based on these first and second detectionsignals.

Further, as shown in FIG. 3, the weights 9 are disposed on the uppersurfaces of the wide portions 751, 761, 771, and 781 of the drive arms75, 76, 77, and 78, and the upper surfaces of the wide portions 711, 721of the detection arms 71, 72, respectively. The weights 9 on the wideportions 751, 761, 771, and 781 are for adjusting the frequency and thevibration balance in the drive vibration mode, and the weights 9 on thewide portions 711, 721 are for adjusting the frequency and the vibrationbalance in the detection vibration mode.

The configuration of the weight 9 is not particularly limited, but theweight 9 can be formed of a metal coating obtained by stacking layersof, for example, Au (gold) or Al (aluminum), or an alloy composedprimarily of Au (gold) or Al (aluminum). In the present embodiment, theweights 9 are formed of Au.

Hereinafter, a method of adjusting the frequency and the vibrationbalance using the weight 9 will briefly be described. As shown in FIG.8, the weights 9 on the drive arms 75, 76, 77, and 78 are irradiatedwith a laser beam L to remove a part of each of the weights 9. Thus, itis possible to reduce the mass of each of the drive arms 75, 76, 77, and78 to raise the frequency in the drive vibration mode. Further, byadjusting an elimination amount and an elimination position of theweight 9 for each of the drive arms 75, 76, 77, and 78, it is alsopossible to adjust the vibration balance in the drive vibration mode.Similarly, as shown in FIG. 9, the weights 9 on the detection arms 71,72 are irradiated with the laser beam L to remove a part of each of theweights 9. Thus, it is possible to reduce the mass of each of thedetection arms 71, 72 to raise the frequency in the detection vibrationmode. Further, by adjusting an elimination amount and an eliminationposition of the weight 9 for each of the detection arms 71, 72, it isalso possible to adjust the vibration balance in the detection vibrationmode.

The laser beam L is not particularly limited, but there can be used apulsed laser beam such as YAG, YVO₄, or excimer laser, or a continuousoscillation laser beam such as carbon dioxide laser. It should be notedthat in the present embodiment, the pulsed laser beam is used as thelaser beam L. Specifically, by continuously irradiating the weights 9with the laser beam L converged like a spot, processing of the weights 9is performed. By using the pulsed laser beam as the laser beam L in sucha manner to thereby change the irradiation time or the irradiation pitchwhile keeping the intensity of the laser beam L without changing theintensity, it is possible to control the irradiation amount, namely anamount of energy, per unit area of the laser beam L to the weights 9.Therefore, the laser beam L is stabilized, and it is possible toaccurately perform the present process.

The diameter of a spot SP of the laser beam L is not particularlylimited, but is preferably, for example, no larger than 20 μm, and ismore preferably no larger than 15 μm. Thus, sufficient microfabricationon the weights 9 becomes possible.

Further, the laser beam L is not particularly limited, but is preferablya picosecond laser beam. It should be noted that the picosecond laserbeam is what is obtained by shortening the pulse width of the laser beamL to the picosecond level. By using the picosecond laser, it is possibleto evaporate the weights 9 with higher peak power compared to, forexample, a typical YAG laser. Therefore, processing low in thermalinfluence becomes possible. Further, it is possible to effectivelyprevent reattachment of the weight material having been evaporated to asurface of the weight 9, and thus, it is possible to effectively preventdross from adhering to the surface of the weight 9.

Further, the pulse width of the laser beam L is not particularlylimited, but is preferably shorter than collisional relaxation time asthe time for the lattice ion temperature of the constituent material ofthe weights 9 to be raised to the melting point. Thus, the advantagedescribed above becomes more conspicuous. In the present embodiment, theweights 9 are formed of Au, and the collisional relaxation time of Au isabout 25 picoseconds. Therefore, the pulse width of the laser beam L ispreferably no more than 25 picoseconds, more preferably no more than 20picoseconds, and further more preferably no more than 10 picoseconds.

By irradiating the weight 9 with such a laser beam L, a part or thewhole of a portion thus irradiated is removed, and thus, processingscars 90 recessed from the surface are formed. It should be noted thatas represented by the solid lines in FIG. 8 and FIG. 9, when a part ofthe portion irradiated with the laser beam L is removed, the weight 9 ismade to be a thin film in that part, and thus, the processing scar 90 isformed of the recessed part. Further, as represented by the dotted linesin FIG. 8 and FIG. 9, when the whole of the portion irradiated with thelaser beam L is removed, the processing scar 90 is formed of a throughhole. The processing scars can each be either one thereof. Further, asdescribed above, since the pulsed laser is used as the laser beam L, theprocessing scar 90 becomes to have a substantially circular spot-likeshape.

The vibrator element 6 has a feature in an arrangement of the processingscars 90. Therefore, hereinafter, the arrangement rule of the processingscars 90, in other words, how the processing scars 90 are arranged atwhat positions on the weight 9, is specifically described. It should benoted that the detection arms 71, 72, and the drive arms 75, 76, 77, and78 are substantially the same in the arrangement rule of the processingscars 90. Therefore, hereinafter, the weight 9 on the drive arm 75 willbe described as a representative, and the description of the weights 9on the rest of the detection arms 71, 72 and the drive arms 76, 77, and78 will be omitted.

As described above, the drive arm 75 is provided with the groove 752opening in the upper surface thereof, and the groove 753 opening in thelower surface thereof. Further, the grooves 752, 753 are each formed bywet etching. Here, quartz crystal as a base material of the vibratingsubstrate 7 has etching anisotropy due to the crystal axes. Therefore,as shown in FIG. 10, the cross-sectional shape of each of the grooves752, 753 fails to become a regular rectangular shape, but becomes anawkward polygon. Further, the grooves 752, 753 become to have a shapeasymmetric about an axis passing through the center O of the drive arm75 along the Z-axis direction.

Therefore, in the cross-sectional view from the Y-axis direction, thecentroid G of the drive arm 75 is shifted toward the negative side inthe X-axis direction from the center O of the drive arm 75. The centroidG mentioned here is a centroid of the whole of the drive arm 75.Further, in the cross-sectional view from the Y-axis direction, thecentroid G of the drive arm 75 and the centroid Gh of the wide portion751 are shifted in the X-axis direction. When these centroid shiftsoccur in the drive arm 75, a torsional vibration Vd1 around the Y axiscentering on the centroid G and an antiplane vibration Vd2 toward theZ-axis direction of the center O occur in the drive arm 75 as theunwanted vibrations besides the in-plane vibration as a principalvibration in the drive vibration mode as shown in FIG. 11. The sameapplies to the other drive arms 76, 77, and 78.

Further, when such centroid shifts occur in the detection arm 71, atorsional vibration Vs1 around the Y axis centering on the centroid G′and an antiplane vibration Vs2 toward the Z-axis direction of the centerO′ occur in the detection arm 71 as the unwanted vibrations besides thein-plane vibration as a principal vibration in the detection vibrationmode as shown in FIG. 12. The same applies to the other detection arm72.

When the unwanted vibration other than the principal vibration occurs inthe detection arms 71, 72 and the drive arms 75, 76, 77, and 78 asdescribed above, the vibration balance of the vibrator element 6 islost, or a vibration leakage in the vibrator element 6 increases, andthus, the vibration characteristics of the vibrator element 6, namelythe angular velocity detection characteristics, deteriorate.

Therefore, in the present embodiment, the arrangement rule of theprocessing scars 90 is set so that the unwanted vibrations describedabove decrease compared to before irradiating the weights 9 with thelaser beam L. Hereinafter, an axis which overlaps the center O of thedrive arm 75 in the plan view from the Z-axis direction, and whichextends along the extending direction of the drive arm 75, namely theY-axis direction, is defined as a central axis Lo, and an axis whichoverlaps the centroid G of the drive arm 75, and which extends along theextending direction of the drive arm 75, namely the Y-axis direction, isdefined as a centroid axis Lg. Here, it can be said that the center O isthe center in the width direction of the upper surface of the arm part750, namely the X-axis direction perpendicular to the Y-axis directionas the extending direction, in the plan view from the Z-axis direction.In other words, it can be said that the central axis Lo is an axis whichdivides the upper surface of the arm part 750 into two equal parts inthe width direction.

Further, an axis which overlaps the centroid Gh of the wide portion 751in the plan view from the Z-axis direction, and which extends along theextending direction of the drive arm 75, namely the Y-axis direction, isdefined as a wide portion centroid axis Lgh. Here, the centroid Gh ofthe wide portion 751 means a centroid of a structure including theelectrodes 8 and the weight 9 formed on the wide portion 751. Since thewide portion 751 is symmetric about the central axis Lo, the wideportion centroid axis Lgh coincides with the central axis Lo in the planview in the Z-axis direction before removing the weight 9.

Further, an axis which overlaps the deepest portion 752 d of the groove752 in the plan view from the Z-axis direction, and which extends alongthe extending direction of the drive arm 75 is defined as an imaginaryaxis Ld. Such an imaginary axis Ld is apt to have a substantiallysymmetric relationship with the centroid axis Lg with respect to thecentral axis Lo. It should be noted that the deepest portion 752 d isconstituted by surfaces each having a width in some cases as shown inFIG. 13 depending on the width and the depth of the groove 752. In thiscase, an axis which overlaps the center in the width direction of thedeepest portion 752 d in the plan view from the Z-axis direction, andwhich extends along the Y-axis direction, namely an axis which dividesthe deepest portion 752 d into two equal parts in the width direction,can be defined as the imaginary axis Ld.

As shown in FIG. 14, the processing scars 90 are formed at least in anarea at an opposite side to the centroid axis Lg, namely an area at theimaginary axis Ld side, with respect to the central axis Lo of theweight 9. In other words, the weight 9 has an area Q1 at the negativeside in the X-axis direction with respect to the central axis Lo, and anarea Q2 at the positive side in the X-axis direction with respect to thecentral axis Lo, and the processing scars 90 are formed in at least thearea Q2. It should be noted that in the present embodiment, theprocessing scars 90 are formed in each of the areas Q1, Q2. In theconfiguration shown in FIG. 14, one processing scar 90 is formed in thearea Q1, and three processing scars 90 are formed in the area Q2.Further, when the area of the processing scar 90 formed in the area Q1is defined as S1, and the area (a sum of the areas of the threeprocessing scars 90) of the processing scars 90 formed in the area Q2 isdefined as S2, the relationship of S1<S2 is fulfilled. It should benoted that the area described above means the opening area of theprocessing scar 90 in the plan view from the Z-axis direction.

Thus, in the decrement of the mass of the weight 9 due to the formationof the processing scars 90, the area Q1 becomes smaller than the areaQ2. In other words, when the decrement of the mass of the weight 9 inthe area Q1 is defined as ΔMq1, and the decrement of the mass of theweight 9 in the area Q2 is defined as ΔMq2, the relationship ofΔMq1<ΔMq2 is fulfilled. Therefore, by forming the processing scars 90,the wide portion centroid axis Lgh is shifted toward the centroid axisLg compared to before forming the processing scars 90. Thus, thecentroid axis Lg and the wide portion centroid axis Lgh can be madecloser to each other, or can preferably be made to coincide with eachother. In FIG. 14, the centroid axis Lg and the wide portion centroidaxis Lgh coincide with each other. Thus, it is possible to reduce theshift between the centroid G and the centroid Gh out of the shiftbetween the center O and the centroid G and the shift between thecentroid G and the centroid Gh as the major causes of the unwantedvibrations. As a result, the unwanted vibration of the drive arm 75described above decreases, and it is possible to effectively prevent thedeterioration of the vibration characteristics of the vibrator element6.

Here, the processing scars 90 are formed by being irradiated with thelaser beam L in the same condition. Therefore, the processing scars 90are the same in shape (opening area and depth) as each other, and arethe same in volume as each other. It should be noted that the term“same” described above means that there is included when there is anerror which can occur in the manufacturing process besides when theshapes are the same as each other. Thus, it is possible to fulfill therelationship of ΔMq1<ΔMq2 as long as the relationship of (the number ofthe processing scars 90 formed in the area Q1)<(the number of theprocessing scars 90 formed in the area Q2) is fulfilled. Therefore, itis possible to more easily decide the arrangement of the processingscars 90.

It should be noted that it is possible for the shape of at least one ofthe processing scars 90 to be different from the shapes of the rest ofthe processing scars 90. In this case, by fulfilling the relationship of(the volume of the processing scars 90 formed in the area Q1)<(thevolume of the processing scars 90 formed in the area Q2), it is possibleto fulfill the relationship of ΔMq1<ΔMq2.

Further, in the plan view from the Z-axis direction, the processingscars 90 are formed at both sides in the X-axis direction with respectto the imaginary axis Ld. In the configuration shown in FIG. 14, twoprocessing scars 90 are formed at the negative side in the X-axisdirection of the imaginary axis Ld, and two processing scars 90 areformed at the positive side in the X-axis direction of the imaginaryaxis Ld. Further, a sum of the areas of the two processing scars 90formed at the negative side in the X-axis direction of the imaginaryaxis Ld and a sum of the areas of the two processing scars 90 formed atthe positive side in the X-axis direction of the imaginary axis Ld areequal to each other. Thus, the processing scars 90 are disposed at bothsides of the imaginary axis Ld in a balanced manner, and it is possibleto prevent the excessive displacement of the wide portion centroid axisLgh toward the negative side in the X-axis direction. Therefore, it ispossible to more surely make the wide portion centroid axis Lgh closerto the centroid axis Lg. Further, the arrangement of the processingscars 90 becomes easier. It should be noted that the term “equal”described above means there is included when the areas are slightlydifferent from each other due to, for example, an error which can occurin the manufacturing process besides when the areas coincide with eachother.

Further, in the plan view from the Z-axis direction, the four processingscars 90 are arranged side by side in the X-axis direction so as to besymmetric about the imaginary axis Ld. Thus, the processing scars 90 aredisposed at the both sides of the imaginary axis Ld in a more balancedmanner, and thus, it is possible to more surely make the centroid axisLg and the wide portion centroid axis Lgh closer to each other. Further,the arrangement of the processing scars 90 becomes easier.

The arrangement rule of the processing scars 90 is hereinabovedescribed. The number and the arrangement of the processing scars 90 arenot particularly limited as long as the relationship of S1<S2 isfulfilled. For example, it is not required to form the processing scar90 in the area Q1. Further, the area of the processing scars 90 formedat the negative side in the X-axis direction of the imaginary axis Ldand the area of the processing scars 90 formed at the positive side inthe X-axis direction of the imaginary axis Ld can be different from eachother. Further, the processing scars 90 formed at the negative side inthe X-axis direction of the imaginary axis Ld and the processing scars90 formed at the positive side in the X-axis direction of the imaginaryaxis Ld can be asymmetric about the imaginary axis Ld. Further, forexample, it is preferable to fulfill the relationship of S1<S2 in all ofthe detection arms 71, 72 and the drive arms 75, 76, 77, and 78, butthis is not a limitation, and it is sufficient to fulfill therelationship of S1<S2 in at least one of the detection arms 71, 72 andthe drive arms 75, 76, 77, and 78.

It should be noted that the four processing scars 90 are the same information position in the Y-axis direction as each other as shown inFIG. 14, but this is not a limitation, and it is possible for at leastone of the processing scars 90 to be formed so as to be shifted in theY-axis direction with respect to the rest of the processing scars 90.

Going back to FIG. 1, the circuit element 3 is fixed to the bottomsurface of the recessed part 211 c. The circuit element 3 includes adrive circuit and a detection circuit for driving the vibrator element 6to detect the angular velocity ωz applied to the vibrator element 6. Itshould be noted that the circuit element 3 is not particularly limited,and can include another circuit such as a temperature compensationcircuit.

Further, the support substrate 4 is a substrate used for TAB (TapeAutomated Bonding) mounting. As shown in FIG. 2, the support substrate 4has a base body 41 shaped like a frame and a plurality of leads 42 asinterconnections provided to the base body 41.

The base body 41 is formed of a film formed of insulating resin such aspolyimide. It should be noted that the constituent material of the basebody 41 is not particularly limited, and the base body 41 can be formedof, for example, insulating resin other than polyimide. Further, thebase body 41 is fixed to the bottom surface of the recessed part 211 awith bonding members B1, and further, the leads 42 and the internalterminals 241 are electrically coupled to each other via the bondingmembers B1. Further, the base part 70 of the vibrator element 6 is fixedto tip portions of the leads 42 with bonding members B2, and further,the leads 42 and the terminals 701 through 706 are electrically coupledto each other via the bonding members B2, respectively. Thus, thevibrator element 6 is supported by the base 21 via the support substrate4, and at the same time, electrically coupled to the circuit element 3.

The base body 41 has a frame-like shape in the plan view from the Z-axisdirection, and has an opening part 411 inside. The six leads 42 arebonding leads for supporting the vibrator element 6, and are wiringpatterns constituted by electrically conductive members havingelectrical conductivity. In the present embodiment, as the electricallyconductive members, there is used a metal material such as copper (Cu)or a copper alloy. The six leads 42 are each fixed to a lower surface ofthe base body 41.

Further, three leads 42 out of the six leads 42 are disposed in apart atthe positive side in the X-axis direction with respect to the center ofthe base body 41, and the tip portions thereof extend to the inside ofthe opening part 411 of the base body 41. Meanwhile, three leads 42 asthe rest of the leads 42 are disposed in a part at the negative side inthe X-axis direction with respect to the center of the base body 41, andthe tip portions thereof extend to the inside of the opening part 411 ofthe base body 41. A base end portion of each of the leads 42 is disposedon a lower surface of the base body 41, and is electrically coupled tocorresponding one of the internal terminals 241 via the bonding memberB1.

Further, the leads 42 each bend in the middle to be tilted upward, andthus, the tip portions thereof are located above, namely at the positiveside in the Z-axis direction of, the base body 41. Further, the basepart 70 of the vibrator element 6 is fixed to the tip portions of theleads 42 via the bonding members B2. Further, the leads 42 areelectrically coupled to the corresponding terminals 701 through 706 viathe bonding members B2, respectively.

It should be noted that the bonding members B1, B2 are not particularlylimited as long as both of the electrical conductivity and the bondingproperty are provided, and it is possible to use, for example, a varietyof metal bumps such as gold bumps, silver bumps, copper bumps, or solderbumps, or an electrically conductive adhesive having an electricallyconductive filler such as a silver filler dispersed in a variety ofadhesives such as a polyimide type adhesive, an epoxy type adhesive, asilicone type adhesive, or an acrylic adhesive. When using the metalbumps which are in the former group as the bonding members B1, B2, it ispossible to suppress generation of a gas from the bonding members B1,B2, and it is possible to effectively prevent a change in environment,in particular rise in pressure, of the internal space S. On the otherhand, when using the electrically conductive adhesive which is in thelatter group as the bonding members B1, B2, the bonding members B1, B2become relatively soft, and it is possible to absorb or relax the stressin the bonding members B1, B2.

The configuration of the vibrator device 1 is hereinabove described.Then, a method of manufacturing the vibrator device 1, in particular, amethod of manufacturing the vibrator element 6 included therein, will bedescribed. As shown in FIG. 15, the method of manufacturing the vibratordevice 1 includes a preparation process of preparing the vibratorelement 6 in a quartz crystal wafer, a first frequency adjustmentprocess of adjusting the frequency of the vibrator element 6 on thequartz crystal wafer, a mounting process of mounting the vibratorelement 6 on the base 21, a second frequency adjustment process ofadjusting the frequency of the vibrator element 6 on the base 21, and asealing process of bonding the lid 22 to the base 21.

Preparation Process

First, by preparing the quartz crystal wafer and patterning the quartzcrystal wafer using a photolithography technique and an etchingtechnique, a plurality of vibrating substrates 7 is formed in the quartzcrystal wafer. Then, the electrodes 8 are formed on the surfaces of thevibrating substrates 7 using sputtering or the like, and further, theweights 9 are formed on the upper surfaces of the wide portions 711,721, 751, 761, 771, and 781 of the detection arms 71, 72 and the drivearms 75, 76, 77, and 78 using evaporation or the like. Thus, thevibrator elements 6 can be obtained.

First Frequency Adjustment Process

Then, the resonance frequency and the vibration balance of the vibratorelement 6 are adjusted on the quartz crystal wafer. Specifically, thefour weights 9 disposed on the drive arms 75, 76, 77, and 78 areirradiated with the laser beam L to form the processing scars 90 basedon such an arrangement rule as described above. Thus, it is possible toadjust the frequency and the vibration balance in the drive vibrationmode, and at the same time, it is possible to effectively reduce theunwanted vibrations of the drive arms 75, 76, 77, and 78 in the drivevibration mode. Similarly, the two weights 9 disposed on the detectionarms 71, 72 are irradiated with the laser beam L to form the processingscars 90 based on such an arrangement rule as described above. Thus, itis possible to adjust the frequency and the vibration balance in thedetection vibration mode, and at the same time, it is possible toeffectively reduce the unwanted vibrations of the detection arms 71, 72in the detection vibration mode.

It should be noted that there is no need to provide the processing scars90 to all of the weights 9, and when there is a weight 9 which is notrequired to be provided with the processing scars 90, it is possible toomit to provide the processing scars 90 to that weight 9. Further, whenthere is a plurality of weights 9 which is required to be provided withthe processing scars 90, it is preferable to form the processing scars90 based on the arrangement rule described above with respect to all ofthe weights 9, but this is not a limitation, and it is sufficient toform the processing scars 90 based on the arrangement rule describedabove with respect to at least one weight 9.

Mounting Process

Then, the vibrator element 6 is broken off from the quartz crystalwafer, and then the vibrator element 6 thus broken off is bonded to thebase 21 via the support substrate 4. It should be noted that the circuitelement 3 is mounted on the base 21 in advance.

Second Frequency Adjustment Process

There is a possibility that the resonance frequency and the vibrationbalance of the vibrator element 6 vary from the resonance frequency andthe vibration balance on the quartz crystal wafer by fixing the vibratorelement 6 to the base 21 in the mounting process described above.Therefore, in the present process, the processing scars 90 are formed toat least one weight 9 to adjust the resonance frequency and thevibration balance in the drive vibration mode and the resonancefrequency and the vibration balance in the detection vibration mode insubstantially the same manner as in the first frequency adjustmentprocess described above. It should be noted that the present process canbe omitted when not required.

Sealing Process

Then, in the vacuum state, for example, the lid 22 is seam welded to anupper surface of the base 21 via the bonding member 23 made of a seamring. Thus, the internal space S is airtightly sealed, and the vibratordevice 1 is obtained.

The method of manufacturing the vibrator device 1 is describedhereinabove, but the method of manufacturing the vibrator device 1 isnot particularly limited providing the method follows the arrangementrule of the processing scars. For example, when performing the secondfrequency adjustment process, the first frequency adjustment process canbe omitted. Further, when performing the first frequency adjustmentprocess, the second frequency adjustment process can be omitted.Further, either one of the first frequency adjustment process and thesecond frequency adjustment process can be performed using a differentfrequency adjustment method from the method described above.

The vibrator device 1 and the method of manufacturing the vibratordevice 1 are hereinabove described. The vibrator element 6 included insuch a vibrator device 1 has the base part 70, and the detection arms71, 72 and the drive arms 75, 76, 77, and 78 as the vibrating armscoupled to the base part 70. Further, the detection arms 71, 72 areprovided with the arm parts 710, 720 each having an elongated shape andhaving the grooves 712, 722 opening in the upper surfaces as theprincipal surfaces, and the wide portions 711, 721 as the weight partswhich are located at the tip side of the arm parts 710, 720, and whichare provided with the weights 9 disposed on the upper surfaces as theprincipal surfaces, respectively. Similarly, the drive arms 75, 76, 77,and 78 are provided with the arm parts 750, 760, 770, and 780 eachhaving an elongated shape and having the grooves 752, 762, 772, and 782opening in the upper surfaces as the principal surfaces, and the wideportions 751, 761, 771, and 781 as the weight parts which are located atthe tip side of the arm parts 750, 760, 770, and 780, and which areprovided with the weights 9 disposed on the upper surfaces as theprincipal surfaces, respectively. Further, the weights 9 are providedwith the processing scars 90 which are partially removed and arerecessed in the thickness direction of the detection arms 71, 72 and thedrive arms 75, 76, 77, and 78, namely the Z-axis direction,respectively. When the axis which overlaps the center O in the widthdirection of the drive arm 75, and which extends along the Y-axisdirection as the extending direction of the drive arm 75 is defined asthe central axis Lo, and the axis which overlaps the centroid G of thedrive arm 75, and which extends along the Y-axis direction as theextending direction of the drive arm 75 is defined as the centroid axisLg in the plan view of the upper surface, the processing scars 90 areformed in at least the area Q2 located at the opposite side to thecentroid axis Lg with respect to the central axis Lo. Further, when thearea of the processing scars 90 located at the centroid axis Lg side ofthe central axis Lo is defined as S1 and the area of the processingscars 90 located at the opposite side to the centroid axis Lg of thecentral axis Lo is defined as S2, the relationship of S1<S2 isfulfilled. It should be noted that this relationship similarly appliesto the detection arms 71, 72 and the drive arms 76, 77, and 78.

Thus, in the decrement of the mass of the weight 9 due to the formationof the processing scars 90, the area Q1 becomes smaller than the areaQ2. In other words, when the decrement of the mass of the weight 9 inthe area Q1 is defined as ΔMq1, and the decrement of the mass of theweight 9 in the area Q2 is defined as ΔMq2, the relationship ofΔMq1<ΔMq2 is fulfilled. Therefore, by forming the processing scars 90,the wide portion centroid axis Lgh is shifted toward the centroid axisLg compared to before forming the processing scars 90. Thus, thecentroid axis Lg and the wide portion centroid axis Lgh can be madecloser to each other, or can preferably be made to coincide with eachother. As a result, the unwanted vibration of the drive arm 75decreases, and it is possible to effectively prevent the deteriorationof the vibration characteristics of the vibrator element 6.

Further, as described above, when the axis which overlaps the deepestportion 752 d of the groove 752 in the plan view of the upper surfaceand which extends along the Y-axis direction as the extending directionof the drive arm 75 is defined as the imaginary axis Ld, the processingscars 90 are formed at the both sides in the X-axis direction as thewidth direction with respect to the imaginary axis Ld. Further, the areaof the processing scars 90 formed at one side in the X-axis directionwith respect to the imaginary axis Ld and the area of the processingscars 90 formed at the other side in the X-axis direction with respectto the imaginary axis Ld are equal to each other. Thus, the processingscars 90 are disposed at the both sides of the imaginary axis Ld in abalanced manner, and thus, it is possible to more surely make thecentroid axis Lg and the wide portion centroid axis Lgh closer to eachother. Further, the arrangement of the processing scars 90 becomeseasier.

Further, as described above, the processing scars 90 are disposedsymmetrically about the imaginary axis Ld. Thus, the processing scars 90are disposed at the both sides of the imaginary axis Ld in a morebalanced manner, and thus, it is possible to more surely make the wideportion centroid axis Lgh closer to the centroid axis Lg. Further, thearrangement of the processing scars 90 becomes easier.

Further, as described above, the processing scars 90 are each shapedlike a spot. Thus, it becomes easy to process the weights 9.

Further, as described above, the vibrator element 6 has the pair ofdetection arms 71, 72 extending toward the both sides in the Y-axisdirection as a first direction from the base part 70, the pair ofcoupling arms 73, 74 extending toward the both sides in the X-axisdirection as a second direction perpendicular to the Y-axis directionfrom the base part 70, the pair of drive arms 75, 76 as the vibratingarms extending toward the both sides in the Y-axis direction from onecoupling arm 73, and the pair of drive arms 77, 78 as the vibrating armsextending toward the both sides in the Y-axis direction from the othercoupling arm 74. Thus, it is possible to effectively adjust thefrequency and the vibration balance in the drive vibration mode of thevibrator element 6.

Further, as described above, the vibrator element 6 has the pair ofdetection arms 71, 72 as the vibrating arms extending toward the bothsides in the Y-axis direction as the first direction from the base part70, the pair of coupling arms 73, 74 extending toward the both sides inthe X-axis direction as the second direction perpendicular to the Y-axisdirection from the base part 70, the pair of drive arms 75, 76 extendingtoward the both sides in the Y-axis direction from one coupling arm 73,and the pair of drive arms 77, 78 extending toward the both sides in theY-axis direction from the other coupling arm 74. Thus, it is possible toeffectively adjust the frequency and the vibration balance in thedetection vibration mode of the vibrator element 6.

Further, as described above, the vibrator device 1 has the vibratorelement 6. Thus, it is possible for the vibrator device 1 to acquire theadvantages of the vibrator element 6, and exert the high reliability.

Further, as described above, the method of manufacturing the vibratorelement 6 includes the step of preparing the vibrator element 6 havingthe base part 70, and the detection arms 71, 72 and the drive arms 75,76, 77, and 78 as the vibrating arms coupled to the base part 70, thestep of forming the processing scars 90 to the weights 9 by irradiatingthe weights 9 with the laser beam L to thin or remove the weights 9 inthe thickness direction of the detection arms 71, 72 and the drive arms75, 76, 77, and 78. It should be noted that the detection arms 71, 72are provided with the arm parts 710, 720 each having an elongated shapeand having the grooves 712, 722 opening in the upper surfaces as theprincipal surfaces, and the wide portions 711, 721 as the weight partswhich are located at the tip side of the arm parts 710, 720, and whichare provided with the weights 9 disposed on the upper surfaces as theprincipal surfaces, respectively. Similarly, the drive arms 75, 76, 77,and 78 are provided with the arm parts 750, 760, 770, and 780 eachhaving an elongated shape and having the grooves 752, 762, 772, and 782opening in the upper surfaces as the principal surfaces, and the wideportions 751, 761, 771, and 781 as the weight parts which are located atthe tip side of the arm parts 750, 760, 770, and 780, and which areprovided with the weights 9 disposed on the upper surfaces as theprincipal surfaces, respectively.

Further, when the axis which overlaps the center O in the widthdirection of the drive arm 75, and which extends along the Y-axisdirection as the extending direction of the drive arm 75 is defined asthe central axis Lo, and the axis which overlaps the centroid G of thedrive arm 75, and which extends along the Y-axis direction as theextending direction of the drive arm 75 is defined as the centroid axisLg in the plan view of the upper surface, the processing scars 90 areformed in at least the area Q2 located at the opposite side to thecentroid axis Lg with respect to the central axis Lo in the step offorming the processing scars 90. Further, when the area of theprocessing scars 90 located at the centroid axis Lg side of the centralaxis Lo is defined as S1 and the area of the processing scars 90 locatedat the opposite side to the centroid axis Lg of the central axis Lo isdefined as S2, the relationship of S1<S2 is fulfilled.

Thus, in the decrement of the mass of the weight 9 due to the formationof the processing scars 90, the area Q1 becomes smaller than the areaQ2. In other words, when the decrement of the mass of the weight 9 inthe area Q1 is defined as ΔMq1, and the decrement of the mass of theweight 9 in the area Q2 is defined as ΔMq2, the relationship ofΔMq1<ΔMq2 is fulfilled. Therefore, by forming the processing scars 90,the wide portion centroid axis Lgh is shifted toward the centroid axisLg compared to before forming the processing scars 90. Thus, thecentroid axis Lg and the wide portion centroid axis Lgh can be madecloser to each other, or can preferably be made to coincide with eachother. As a result, the unwanted vibration of the drive arm 75decreases, and it is possible to effectively prevent the deteriorationof the vibration characteristics of the vibrator element 6.

Although the vibrator element, the vibrator device, and the method ofmanufacturing the vibrator element according to the present disclosureare hereinabove described based on the illustrated embodiment, thepresent disclosure is not limited thereto, but the configuration of eachof the constituents can be replaced with one having an arbitraryconfiguration with an equivalent function. Further, the presentdisclosure can also be added with any other constituents. Further, it isalso possible to arbitrarily combine any of the embodiments with eachother.

What is claimed is:
 1. A vibrator element comprising: a base part; and a vibrating arm provided with an arm part which is coupled to the base part, which has a groove opening in a principal surface, and which has an elongated shape, and a weight part which is located at a tip side of the arm part, and which has a weight disposed on the principal surface, wherein the weight is provided with at least one processing scar which is partially removed, and which is recessed in a thickness direction of the vibrating arm, when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is defined as a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is defined as a centroid axis in a plan view of the principal surface, the processing scar is formed in at least an area at an opposite side to the centroid axis with respect to the central axis, and S1<S2, an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2.
 2. The vibrator element according to claim 1, wherein when an axis which overlaps a deepest portion of the groove in a plan view of the principal surface, and which extends along the extending direction of the vibrating arm is defined as an imaginary axis, the processing scars are formed at both sides in the width direction with respect to the imaginary axis, and an area of the processing scar formed at one side in the width direction with respect to the imaginary axis and an area of the processing scar formed at another side in the width direction with respect to the imaginary axis are equal to each other.
 3. The vibrator element according to claim 2, wherein the processing scars are disposed symmetrically about the imaginary axis.
 4. The vibrator element according to claim 1, wherein the processing scar is shaped like a spot.
 5. The vibrator element according to claim 1, comprising: a pair of detecting arms extending toward both sides in a first direction from the base part; a pair of coupling arms extending toward both sides in a second direction perpendicular to the first direction from the base part; a pair of drive arms as the vibrating arms extending toward the both sides in the first direction from one of the coupling arms; and a pair of drive arms as the vibrating arms extending toward the both sides in the first direction from the other of the coupling arms.
 6. The vibrator element according to claim 1, comprising: a pair of detection arms as the vibrating arms extending toward the both sides in the first direction from the base part; a pair of coupling arms extending toward both sides in a second direction perpendicular to the first direction from the base part; a pair of drive arms extending toward the both sides in the first direction from one of the coupling arms; and a pair of drive arms extending toward the both sides in the first direction from the other of the coupling arms.
 7. A vibrator device comprising: the vibrator element according to claim
 1. 8. A method of manufacturing a vibrator element, comprising: preparing a vibrator element having a base part, and a vibrating arm provided with an arm part which is coupled to the base part, which has a groove opening in a principal surface, and which has an elongated shape, and a weight part which is located at a tip side of the arm part, and which has a weight disposed on the principal surface; and forming at least one processing scar to the weight by irradiating the weight with a laser beam to thin or remove the weight in a thickness direction of the vibrating arm, wherein when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is defined as a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is defined as a centroid axis in a plan view of the principal surface, the processing scar is formed in at least an area at an opposite side to the centroid axis with respect to the central axis in the forming at least one processing scar, and S1<S2, an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2. 